Development of Temporary Bonding and Debonding (TBDB) Process for Hybrid Bonding Advance Packaging

This work investigates the applicability of three different temporary bonding/debonding (TBDB) materials for advanced hybrid bonding integration. A systematic evaluation was conducted across the key process steps, including bonding, wafer thinning, low-temperature chemical vapor deposition (CVD), debonding, and post-cleaning. Optical microscopy confirmed that all three TBDB materials exhibited clean bonding interfaces without adhesive residue or voids. During wafer thinning, all materials withstood backgrinding to$50 \mu \mathrm{m}$without cracking or chipping; however, the film-type TBDB material demonstrated superior thickness uniformity ($\approx 2 \mu \mathrm{m}$) compared to spin-coated TBDB materials ($\approx 5 \mu \mathrm{m}$). Subsequent low-temperature CVD processing ($\leqslant 200^{\circ} \mathrm{C}$) showed that all bonded wafers maintained interfacial integrity under high vacuum and plasma power, with no delamination or void formation. In the debonding and post-cleaning steps, distinct differences emerged. The film-type TBDB material, debonded via UV irradiation, required no chemical cleaning and exhibited the lowest particle counts after automated optical inspection (AOI). In contrast, spin-coated TBDB materials, debonded by laser, required chemical cleaning to remove residual adhesive; while thermoplastic TBDB could be effectively cleaned, the thermosetting TBDB suffered from dicing tape erosion and dies loss, reducing yield. AOI revealed that spin-coated TBDB wafers retained > 60k particles, posing significant challenges for subsequent hybrid bonding. Overall, the results demonstrate that while all three TBDB materials are mechanically robust and compatible with bonding, thinning, and CVD processes, the film-type TBDB material offers clear advantages in thinning uniformity, post-debond cleanliness, and particle control. These findings highlight the film-type TBDB as a more suitable candidate for high-yield hybrid bonding in advanced 3D integration and semiconductor packaging applications.