纳米孔
制作
极紫外光刻
材料科学
纳米技术
平版印刷术
氮化硅
光刻
光电子学
抵抗
硅
下一代光刻
X射线光刻
蚀刻(微加工)
纳米光刻
多重图案
电子束光刻
氮化物
极端紫外线
作者
A. Ray Chaudhuri,Eric Beamish,Bert Du Bois,P. Guell,A. Walikar,E. Vecchio,T. Vossen,Alexey Podkovskiy,W. Renckens,W.Botermans W. Botermans,Sanjin Marion,Haris Osman,Paru Deshpande,S. Severi,Paul Van Dorpe
标识
DOI:10.1109/iedm50572.2025.11353639
摘要
We present the first successful demonstration of wafer-scale fabrication of solid-state nanopores using Extreme Ultraviolet (EUV) lithography. Specifically, we fabricated pores with a diameter down to approximately 10 nm within silicon nitride (Si3N4) membrane. Through a combination of direct patterning via EUV lithography and subsequent fabrication steps employing a spacer approach, we achieved highly uniform pores of precisely controlled dimensions across the entire wafer. The fabricated nanopores were thoroughly characterized in an aqueous environment, assessing their current-voltage (I-V) characteristics and noise performance. Device functionality was subsequently validated through the successful translocation of DNA molecules. Based on these findings, we project that this fabrication process demonstrates significant potential for realizing both single nanopores and multi-pore arrays with various tuneable dimensions within a single wafer, thereby targeting a wide range of applications.
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