Failure Mechanism Analysis and Diagnosis Related to Packaging of Lamp LED
作者
Jimeng Wang,Ziyi Liu,Jingjing Yan,Xin Rui Ding,Jinlin Zou
出处
期刊:2019 4th International Conference on Mechanical, Control and Computer Engineering (ICMCCE)日期:2019-10-01卷期号:: 380-3804被引量:1
标识
DOI:10.1109/icmcce48743.2019.00091
摘要
Packaging structure is one of the important field of device quality. In order to help the engineers to improve quality level and reduce the failure rate in using of lamp LED product, we should realize the failure mode, failure mechanisms and root causes of lamp LED package. Method: First, more than 100 failure analysis cases about lamp LED package have been carried out by the authors. And the authors made a summary of these cases. The main failure modes of lamp LED package are introduced. Then, based on these failure modes, the possible mechanism of each type of failure mode and the root causes of failures are analyzed in detail. Finally, A lot of cases are used to support the analysis in this article. Result: all failure modes, corresponding failure mechanisms and root causes are summarized in a form for reference to engineers and technicians engaged in failure analysis and product improvement. Conclusion: The failure mode of lamp LED package in the use is no light, or intermittently no light, or the intensity of light is weak. But its failure mechanism and related reasons are directing to packaging process, structure and materials.