Towards In Situ Failure Analysis of Multi-Layer Ceramic Capacitors Using X-ray Nano-Laminography

Abstract Multilayer ceramic capacitors (MLCCs) are ubiquitous in modern electronics, with trillions produced annually and applications spanning from consumer devices to aerospace systems. Their compact size and high reliability make them essential, but they are also prone to a range of failure modes—such as cracks, voids, and solder joint degradation—introduced during manufacturing, assembly, or operation. Traditional failure analysis methods are destructive and time-consuming. In this study, we explore and compare high-resolution X-ray nano-computed tomography (nano-CT) of individual MLCCs with X-ray nano-computed laminography (nano-CL), including in situ imaging of a capacitor mounted on a PCB. We discuss trade-offs between measurement time, spatial resolution, and image quality, highlighting how advanced X-ray techniques can accelerate failure analysis workflows.