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Relationship and mechanism between double cold rolling-aging process, microstructure and properties of Cu–Ni–Si alloy prepared by two-phase zone continuous casting

材料科学 合金 微观结构 电阻率和电导率 冶金 极限抗拉强度 位错 再结晶(地质) 相(物质) 复合材料 古生物学 化学 有机化学 电气工程 生物 工程类
作者
Wanneng Liao,Xue-Feng Liu,Yaohua Yang
出处
期刊:Materials Science and Engineering A-structural Materials Properties Microstructure and Processing [Elsevier BV]
卷期号:797: 140148-140148 被引量:62
标识
DOI:10.1016/j.msea.2020.140148
摘要

Developing Cu–Ni–Si alloy with high strength and high electrical conductivity is a key issue in the electrical conductor industries. The C70250 copper alloy was prepared by two-phase zone continuous casting (TZCC) technology first, and then carried out by double cold rolling-aging process. The relationship between different double cold rolling-aging processes, microstructure, mechanical properties and electrical conductivity of the alloy was studied in detail, the mechanism was revealed. The results show that the C70250 copper alloy strip fabricated by TZCC technology can be subjected to large deformation double cold rolling-aging treatment. When the alloy is primary cold rolled by 97.5% reduction rate, primary aged at 400 °C for 30 min, second cold rolled by 60% reduction rate, second aged at 400 °C for 45 min, the tensile strength and electrical conductivity of the alloy can reach 879 MPa and 48.9% IACS respectively, owning excellent comprehensive properties. The Ni2Si phases inside C70250 copper alloy after primary aging effectively pin dislocations during the secondary cold rolling process, which forms high density dislocation entanglement, promotes the further precipitation of Ni2Si phase during the process of secondary aging, and finally produces a large number of fine, dispersed, multi-scale mixed and evenly distributed Ni2Si phases, the increase of alloy strength is mainly ascribed to dislocation and Orowan strengthening effect. Solute atoms inside the C70250 copper alloy get adequately precipitated after large deformation double cold rolling-aging treatment, the recrystallization is delayed, and the fibrous microstructure along the rolling direction is produced, the scattering effect of transverse grain boundaries and solute atoms on electrons is significantly reduced, which is helpful to improve the electrical conductivity of the C70250 copper alloy.
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