Surface Textured Drill Tools—An Effective Approach for Minimizing Chip Evacuation Force and Burr Formation During High Aspect Ratio Machining of Titanium Alloy

机械加工 演习 钻探 推力 炸薯条 机械工程 刀具磨损 碎屑形成 材料科学 扭矩 工程类 物理 电气工程 热力学
作者
S. Niketh,G.L. Samuel
出处
期刊:Journal of Manufacturing Science and Engineering-transactions of The Asme [ASM International]
卷期号:143 (4) 被引量:13
标识
DOI:10.1115/1.4048432
摘要

Abstract The real challenge pertaining to high aspect ratio drilling is the rapid increase in chip evacuation force due to the chip clogging phenomenon occurring at higher drilling depths. The clogged chips will further impede the reachability of cutting fluid at the machining zone leading to the tool temperature buildup. This will eventually result in the catastrophic failure of the tool. Hence, in the present work, an attempt has been made to minimize the chip evacuation force by functionalizing the drill tool surfaces based on the laser microtexturing principle. Microscale textures in the form of circular dimples were created on the flute and margin side of the drill tool with an objective to control the sliding friction, thereby minimizing the chip clogging effect. The effectiveness of the functionalized drill tools were assessed mainly based on the variation in thrust force and torque. Drilling experiments showed a net reduction of 17.18% in thrust force and 26.98% in torque while machining Ti–6Al–4V using the flute and margin textured tool, which justified the effectiveness of micro scale textures in minimizing the chip evacuation forces. The experimental analysis was further extended in terms of burr height evaluation, where FMT tools were found to be highly effective in burr height reduction (1.29 mm), showing a net reduction of 54.26% when compared with the non-textured tool. The outcomes from this research work will be highly beneficial for the manufacturing industries including aerospace, automobile, and spacecraft as high aspect ratio drilling of titanium alloys are still categorized to be the most challenging machining process owing to its lower thermal conductive property.
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