Nanoscale investigation of surface wettability distribution on bubble nucleation with variable temperature boundary condition

Surface wettability plays an essential role in bubble nucleation. In this article, the molecular dynamics simulation method is conducted to study the bubble nucleation of liquid argon film on a copper substrate with hybrid wettability. Unlike the constant temperature boundary condition, the variable temperature boundary condition is adopted to simulate the bubble nucleation process. The temperature gradually increases from 86 K to 200 K, so the substrate temperature at the bubble nucleation time can be obtained. The potential energy, kinetic energy, total energy, and temperature during bubble nucleation are analyzed. The results show that bubble nucleation occurs when the kinetic energy exceeds the potential energy barrier. A method is used to capture the bubble nucleation process, described from the perspective of total energy. The initial nucleation time of the hybrid wettability surface gradually reduces with the rise of the proportion of the hydrophilic part. Compared with the pure hydrophilic surface, the hybrid wettability surface can achieve faster initial nucleation time and lower nucleation temperature by altering the proportion of wettability. The potential energy and temperature distribution reveal the microscopic mechanism of bubble nucleation. This study provides theoretical guidance for the design of cooling surfaces of micro/nanoelectronic devices.