材料科学
形状记忆合金
微观结构
复合材料
合金
弯曲
激光功率缩放
极限抗拉强度
扫描电子显微镜
热导率
形状记忆合金*
马氏体
粒度
激光器
融合
光学
物理
数学
组合数学
语言学
哲学
作者
Kaijie Lin,Huiping Tian,Dongdong Gu,Chaochao Wang,Luhao Yuan,Jianfeng Sun
标识
DOI:10.1002/adem.202301224
摘要
Cu‐based shape‐memory alloys (Cu‐based SMAs) demonstrate prospects in active heat sinks due to their excellent thermal conductivity, high transformation temperature, and low cost. However, their inferior mechanical properties have hindered their industrial application. Previous studies have indicated that mechanical properties can be improved by decreasing grain size and minimizing microstructural segregation, which can be achieved by laser powder bed fusion (LPBF) process. This work investigates the influence of process parameters on the processability, microstructure, and shape‐memory effect (SME) of 81.95Cu–11.85Al–3.2Ni–3Mn (wt%) thin‐walled samples fabricated by LPBF. Results reveal that laser power and scanning speed significantly affect the relative density of the Cu‐based SMA thin‐walled samples, and higher laser power and scanning speed contribute to better processability. Additionally, the high cooling rate during the LPBF process facilitates the formation of β 1 ′ martensite without requiring posttreatment, and the size of the β 1 ′ martensite decreases with increasing scanning speed. In bending‐recovery experiments, specimens fabricated at higher scanning speed exhibit the highest SME recovery rate and bending angle. Moreover, the test confirms that Cu‐based SMA formed at lower scanning speeds exhibits even higher thermal conductivity. This work shows the potential of fabricating high‐performance Cu‐based SMA components by LPBF.
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