Etching processes of Si>111< wafers for fabrication of microphotonic components

This paper presents the experiments we have performed to obtain microphotonic components by anisotropic wet etching of Si-oriented wafers. We studied influence of the mask orientation and lay-out, and of the technological parameters (temperature, concentration of the etching solution) on the shape and size of the etched cavity. We experimented fabrication of freestanding structures made by SiO/sub 2/ and c-Si that can be used as movable micromirrors; and waveguides.