电阻抗断层成像
电阻抗
输出阻抗
高阻抗
欧米茄
材料科学
放大器
CMOS芯片
成像体模
物理
校准
电气工程
电压
光电子学
光学
工程类
量子力学
作者
Soyeon Um,Jaehyuk Lee,Hoi‐Jun Yoo
标识
DOI:10.1109/esscirc59616.2023.10268764
摘要
This paper proposes an advanced electrical impedance tomography (EIT) imaging IC that is designed to enhance stability against contact impedance variations. The 6 m$\mathrm{m}^{2}$ chip is fabricated using a TSMC 180 nm CMOS process and contains 2 key features: 1) a high input impedance instrumentation amplifier (IA) with auxiliary source followers for robust voltage sensing, and 2) a Trans-Conductance (TC) current driver with Trans-Impedance (TI) monitoring circuit for precise measurement of the injected current while eliminating the loading effect. The proposed IC has a low power dissipation of only3.8 mW, excluding the injection current, and offers an impressive impedance resolution of 1.9 m$1.9 \mathrm{~m} \Omega / \sqrt{ } \mathbf{H z}$. The input impedance of the IA has been increased up to 2.9 G$\Omega$ at 100 Hz and 230 k$\Omega$ at 1 MHz, indicating high performance over a wide range of frequencies. The effectiveness of the proposed EIT imaging IC is demonstrated by successfully reconstructing 3D images of a human body phantom using a mobile device.
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