Enhanced performance of GaN based VCSELs through graded electron-blocking layer design

Abstract Electron leakage from the active region to the p-type region restricts the performance of GaN-based Vertical-Cavity Surface-Emitting Lasers (VCSELs). AlGaN EBL can decrease the leakage current, but also raises the hole injection barrier and reduce the hole injection efficiency. Then, it is important to design EBL structures that can enhance both electron blocking and hole injection. In this study, VCSEL devices with three different EBL, basic structure Al 0.6 Ga 0.4 N EBL labeled as Device A, newly proposed 16 nm thick Al 0.75–0.80 Ga 0.25–0.20 N EBL labeled as Device B, and 18 nm thick Al 0.75–0.80 Ga 0.25–0.20 N EBL labeled as Device C, respectively, are designed and analyzed using PICS 3D simulation. Device A represents a basic VCSEL structure, while Device C incorporates a graded electron-blocking layer (EBL) with adjusted thickness. Through simulation results, it is observed that the introduction of a graded EBL in Device C leads to significant performance enhancements compared to the basic structure of Device A. Specifically, the graded EBL effectively reduces band bending and increases the electron barrier height, thereby improving carrier confinement and reducing electron leakage. Additionally, the utilize of a Graded structure in Device C aids in strain relief at the layout between the QB and EBL, resulting in improved electron-blocking capability and potentially enhanced hole transport characteristics. These findings underscore the importance of EBL grading in optimizing the performance of VCSELs, highlighting its potential for advancing the efficiency and functionality of these semiconductor devices. Power of the device C is being improved upto 4.16%, similarly the conduction band barrier height is improved upto 26.6% which is beneficial for better VCSEL performance as it enhances electron confinement in the active region, leading to increased efficiency and reduced carrier leakage and valance band barrier height decreases upto 6.52% and threshold current is decreased upto 4.8% so if valence band barrier height decrease the hole injection efficiency increases and if threshold current decreases the emitting power of the device increase.