Preparation of heat conductive materials by combining heat conductive fillers
作者
Kang ZHANG,Jianhui Qiu,Eiichi Sakai,Guohong Zhang,Qifan Liu,Hiroyuki Yamaguchi,Yasunori Chonan
出处
期刊:M & M Zairyo Rikigaku Kanfarensu [The Japan Society of Mechanical Engineers] 日期:2021-01-01卷期号:2021: OS0117-OS0117
标识
DOI:10.1299/jsmemm.2021.os0117
摘要
With the development of electronic information technology, there is an increasing demand for materials with high thermal conductive. In this report, BN and CNT are used as mixed fillers to improve the thermal conductivity and maintain the insulation of silicone rubber. This is mainly because BN can destroy the conductive network formed by CNTs while ensuring the integrity of thermal conductive network. After the thermal conductive silicone rubber was obtained, the thermal conductivity of silicone rubber is measured by a thermal conductivity tester and the electrical conductivity is measured by a four-probe tester. As expected, the addition of thermal conductive filler can improve the thermal conductivity of silicone rubber. When the BN content up to 10 wt%, the thermal conductivity of silicone rubber reaches 0.404 W/(m*K). However, due to only simple mixing, the interface thermal resistance between BN and CNT cannot be ignored. The thermal conductivity of silicone rubber decreases with the increase of CNT content. At the same time, the conductivity has not changed significantly, and the silicone rubber is still insulating.