焊接
电流(流体)
材料科学
热的
印刷电路板
铜
电气工程
机械工程
电子工程
光电子学
工程类
复合材料
冶金
物理
气象学
作者
Andrei Drumea,Cristina Marghescu
标识
DOI:10.1109/siitme53254.2021.9663645
摘要
The paper investigates some techniques for the increase of the current carrying capabilities of PCB tracks – tinning and soldering of copper wires onto tracks. Such sample boards with tracks of different widths and enhancements were tested at different currents and electrical and thermal measurements were performed. The increase of the current carrying capability and thermal behavior of the PCB tracks are analyzed and some conclusions are presented.
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