THERMAL BALLISTIC-DIFFUSIVE TRANSPORT BETWEEN SOLID-SOLID CONTACT INTERFACE

The thermal contact interface resistance is a key technical problem in many fields,because of its features of the dependence of the multi-scale and micro-structure.With device or structure characteristic length scales becoming comparable to the mean free path and wavelength of heat carriers,classical Fouerier laws are no longer valid and new approach must be taken to develop.Based on diffusive and ballistic transport of the heat carrier,made a distinction between interface and sub-surface for interface layer,the transfer coefficient was solved using the radiation attenuation equations,and a diffusive-ballistic model was built up to predict the thermal contact interface layer resistance.The analysis shows that the diffusive-ballistic model is more precise comparing with the acoustic diffusive model in the higher temperature for the thermal contact interface layer resistance prediction of the thin film of YBCO on MgO substrate.It is useful to analyze the thermal contact interface layer resistance using the diffusive-ballistic model.