A Thermal Fatigue Model for Surface Mount Leadless Chip Resistor (LCR) Solder Joints

Abstract The reliability of surface mount leadless solder joints, e.g., LCCC (leadless ceramic chip carrier), LCR (leadless chip resistor), and LCC (leadless chip capacitor), has been a long-term research topic due to the concern of thermal fatigue failure resulting from significant stresses and strains induced in the joint. Numerous studies of failure analysis of leadless solder joints exist in the literature, and a number of life prediction models based on different failure characterizing parameters, e.g., total strain, plastic strain, strain energy density, etc., have been developed for particular loading conditions, such as isothermal or thermal cyclic fatigue tests. To name a few, e.g., one can refer to Engelmaier (1984), Cltterbaugh and Charles (1985), Hall and Sherry (1986), Clech and Augis (1987), Wong et al. (1988), Bae et al. (1989), Solomon (1990), Frear et al. (1991), Satoh et al. (1991), Lee and Stone 91991), Lau (1991), Govila et al. (1994), Schroeder and Mitchell (1994), JPL (1994), Syed (1995), Wen and Ross (1995), Jih and Pao (1995), Zhang et al. (1996), Kawai et al. (1996), Hu (1996), Guo and Conrad (1996), Lin et al. (1996), and Lau and Pao (1996).