UV-curable silicone pressure-sensitive adhesive based on thiol-ene reaction

In order to improve the curing efficiency and reduce energy consumption of silicone pressure-sensitive adhesive (SiPSA), a kind of UV-curable SiPSA based on thiol-ene reaction was prepared with methyl vinyl MQ resin as hard segment, methyl vinyl silicone rubber (110-2S) as soft segment and mercaptyl silicone oil as cross-linker. The UV-cured SiPSA exhibited excellent thermal stability and water resistance. Its physical features such as chemical composition, cross-linking extent and dispersion of MQ resin in silicone rubber were directly related to the vinyl content in MQ resin, the thiol/ene ratio and the resin/rubber ratio, which further affected mechanical properties and adhesive properties of SiPSA. With the vinyl content in MQ resin of 56 mmol/100 g, the thiol/ene molar ratio of 0.8 and the resin/rubber mass ratio of 1.4, the UV-cured SiPSA-B1.4–0.8 had better mechanical properties, moreover it had higher tensile shear strength of >2.0 MPa and showed interface failure on the surface of substrates, indicating that it had great potential applications as PSA.