收发机
波分复用
计算机科学
光电子学
光学性能监测
误码率
材料科学
电子工程
电信
工程类
波长
频道(广播)
CMOS芯片
作者
Pavan Bhargava,Daniel Jeong,E. Jan,Derek Van Orden,Derek Kita,Hayk Gevorgyan,Sidney Buchbinder,Anatoly Khilo,Woorham Bae,Sung-Jin Kim,John M. Fini,Norman Chan,Chen Sun
标识
DOI:10.1109/vlsitechnologyandcir46783.2024.10631547
摘要
We present a 256Gbps WDM transceiver macro for use in co-packaged AI scale-out interconnects. The macro adopts a $8\lambda\times 32\text{Gbps}$ configuration to achieve 256Gbps per fiber. The transceiver macro operates error-free across a dynamic temperature ramp of 50-110°C, has >4dB optical link margin with $4\text{dBm}/\lambda$ input laser power, and consumes 3.45pJ/b ($\text{TX}+\text{RX}$). All transmit, receive, thermal control, and optical components are monolithically integrated in a 45nm SOI process. An optical I/O chiplet with 8 WDM transceiver macros achieves <10−15 BER without FEC across 90 hours of operation in a 4Tbps duplex link configuration.
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