Ball Grid Array Package Intermittent Partial Connection Defect Analysis in DDR4 Data Channel
计算机科学
电子工程
工程类
作者
Muhammad Waqar,Young-bin Chang,H. J. Park,Sanghyeon Baeg
出处
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology [Institute of Electrical and Electronics Engineers] 日期:2025-01-16卷期号:15 (2): 367-376被引量:1