Bonding Technologies of BSCCO High Temperature Superconductor Materials

Bi-Sr-Ca-Cu-O(BSCCO)high temperature superconductor materials will be extensively used for electrical engineering applications.In this paper,systematic summarizations were made on the bonding technology developments of BSCCO superconductor materials,with emphases on the conventional diffusion bonding of BSCCO tapes through first cold welding and then reaction annealing at high temperature.The disadvantages of the available bonding technologies were appointed out.In addition,the recent achievements with the new technology of direct pressuring diffusion bonding at high temperatuse were expounded.