Co-integration of TSV mid process and optical devices for Silicon photonics interposers

In the framework of High Performance Computing and Datacom, silicon photonics interposers propose an interesting approach, while providing new challenges. This paper demonstrates such an integration and focuses on TSV Mid integration impact on sensitive photonic structures such as ring modulators, focusing on two specific technological aspects: substrate thinning and TSV integration. It is shown that thinning down to 100 microns and integrating TSV do not impact photonic performances more than wafer level process variability. Finally, thanks to these results, 3D Si photonics design opportunities will be discussed.