抛光
研磨
图层(电子)
化学机械平面化
材料科学
光学显微镜
复合材料
基质(水族馆)
扫描电子显微镜
地质学
海洋学
作者
Hiroshi Yamaguchi,Shinya Watanabe,Yu Yamaoka,Kimiyoshi Koshi,Akito Kuramata
标识
DOI:10.35848/1347-4065/abcb1c
摘要
Abstract Subsurface damage (SSD) in chemical mechanical polishing (CMP)-finished (010)-oriented β -Ga 2 O 3 substrates was investigated using optical microscopy and X-ray topography (XRT). Damaged layers at the surface of (010)-oriented substrates caused by lapping and mechanical polishing had measured thicknesses of 50 μ m and 20 μ m, respectively, but no detectable damage was caused by CMP. The damage remained as SSD underneath the CMP-finished surface unless the SSD was completely removed by heat treatment. XRT images of an SSD-free (010)-oriented substrate prepared using CMP after heat treatment unambiguously showed dislocations and twin boundaries.
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