材料科学
热导率
聚合物
导电体
复合材料
热传导
导电聚合物
电子设备和系统的热管理
热的
机械工程
热力学
物理
工程类
作者
Xiangfan Xu,Jun Zhou,Jie Chen
标识
DOI:10.1002/adfm.201904704
摘要
Abstract The demand for flexible conductive materials has motivated many recent studies on conductive polymer–based materials. However, the thermal conductivity of conductive polymers is relatively low, which may lead to serious heat dissipation problems for device applications. This review provides a summary of the fundamental principles for thermal transport in conductive polymers and their composites, and recent advancements in regulating their thermal conductivity. The thermal transport mechanisms in conductive polymer–based materials and up‐to‐date experimental approaches for measuring thermal conductivity are first summarized. Effective approaches for the regulation of thermal conductivity are then discussed. Finally, thermal‐related applications and future perspectives are given for conductive polymers and their composites.
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