3-D assembly interposer technology for next-generation integrated systems

Interposers are responsible for 40% of total packaging costs, excluding measurement and testing. With two-layer wiring, this ratio rises to 70%. This interposer uses a simple, two-metal process for low cost. The article shows a sub-materials cost comparison between this interposer and a conventional 2-metal interposer. With this interposer, cost savings are 50%. This is done by eliminating costly laser drilling, via metalization, and ball mounting processes, replacing high-priced photosensitive polyimide with an inexpensive insulator, and by this production system.