Fast MSL analysis of microelectronic packages by using equal weight increasing method

With the wide application of microelectronics packaging products in the industry, the chip have been more and more attention in the harsh environment of high temperature, high humidity. Therefore how to rapidly deliver high reliability products to market has been one of the issues of concern in the microelectronics industry. However moisture sensitivity level (MSL) analysis in microelectronics packaging is one of the most time consuming problem. Thus it is important to study the mechanism and method of the analysis of moisture sensitivity and shorten the analysis time. In this paper the fast analysis of microelectronic package MS L is achieved by the approach of an equal weight of water increasing at different conditions by simulation. According to project requirements, the ESOP8 is chosen as experimental device. Further the model is established, which is used to calculate equal moisture weight increase, and 10 to 67 acceleration factors are obtained. The purpose of this paper is to realize MSL the fast reliability evaluation method for microelectronics packaging industry. Finally using ANS YS finite element simulation is for the calculation.