Effect of Ag Particles on Wettability and Creep Rupture Life of SnCu Based Composite Solders

Particle-enhanced is the way to improve properties of solder alloys. In the present work, the influence of Ag particle-enhanced on the wettability and creep rupture life of 99.3Sn0.7Cu eutectic solder with Ag content of 1vol% to 10vol% were investigated. It was indicated that the wettability of the composite solders could be improved by adding minute amount of Ag particles. With increasing the amount of Ag particles, the spreading areas of the composite solders increased when Ag was below 5vol%. When Ag was above 5vol%, the spreading areas started decreasing. When Ag content was up to 10vol%, the wettability of the composite solder sharply deteriorated. In addition, the creep rupture lives of the composite solders were longer than that of 99.3Sn0.7Cu eutectic solder at the same condition. When Ag content was 5vol%, the creep rupture life of the composite solder was the longest among the investigated composite solders and about 23 times of that of 99.3Sn0.7Cu eutectic solder.