System-on-Package and its Research Areas

System-on-package(SOP) or System-in-package(SIP) is a concept which is different from that of conventional package. It integrates an entire electronic system or subsystem into a package in which there are various actives, such as digital, RF, optical and sensors, and passives like capacitors, resistors, inductors, filters, etc. The devices and components can be both embedded in a substrate or mounted on a substrate surface(SMT). SOP/SIP is a challenge to the traditional package technology, which leads to improvement not only in packaging technology,but also in electronic manufacture industry. This paper discussed the SOP/SIP concept, highlighted its research areas and an impact on electronic manufacturing.