材料科学
掺杂剂
有机场效应晶体管
接触电阻
晶体管
光电子学
半导体
电子迁移率
有机半导体
图层(电子)
二极管
场效应晶体管
纳米技术
兴奋剂
电气工程
电压
工程类
作者
Akifumi Yamamura,Takaaki Sakon,Kayo Takahira,Takahiro Wakimoto,Mari Sasaki,Toshihiro Okamoto,Shun Watanabe,Jun Takeya
标识
DOI:10.1002/adfm.201909501
摘要
Abstract Although high carrier mobility organic field‐effect transistors (OFETs) are required for high‐speed device applications, improving the carrier mobility alone does not lead to high‐speed operation. Because the cut‐off frequency is determined predominantly by the total resistance and parasitic capacitance of a transistor, it is necessary to miniaturize OFETs while reducing these factors. Depositing a dopant layer only at the metal/semiconductor interface is an effective technique to reduce the contact resistance. However, fine‐patterning techniques for a dopant layer are still challenging especially for a top‐contact solution‐processed OFET geometry because organic semiconductors are vulnerable to chemical damage by solvents. In this work, high‐resolution, damage‐free patterning of a dopant layer is developed to fabricate short‐channel OFETs with a dopant interlayer inserted at the contacts. The fabricated OFETs exhibit high mobility exceeding 10 cm 2 V −1 s −1 together with a reasonably low contact resistance, allowing for high frequency operation at 38 MHz. In addition, a diode‐connected OFET shows a rectifying capability of up to 78 MHz at an applied voltage of 5 V. This shows that an OFET can respond to the very high frequency band, which is beneficial for long‐distance wireless communication.
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