A graphene/C-PDA/carbon fiber ternary heterostructure network enables lightweight polyimide composites with enhanced electromagnetic shielding and thermal management capabilities

A ternary carbon heterostructure polyimide composite with outstanding EMI shielding (∼95 dB) and high thermal conductivity (3.38 W m −1 K −1 ) was synthesized via interfacial engineering, defect modulation, and a vacuum-assisted impregnation method.