ABSTRACT UiO‐66 and its derivatives have received widespread attention due to their strong chemical tunability, high specific surface area, and stability. In order to further improve the adsorption properties of the UiO‐66 adsorbent on toluene, the Cu@UiO‐66 material ( n (Cu 2+ ) = 0.05, 0.1, 0.15) has been prepared using a solvent thermal method based on the formic acid (FA)‐modified material FA@ UiO‐66‐2. The results of the dynamic adsorption experiments showed that Cu@UiO‐66‐2 exhibited the highest toluene adsorption capacity, and the maximum adsorption capacity was 481 mg g −1 . Doping Cu 2+ resulted in an increase in unsaturated metal sites, and Cu 2+ acted as Lewis acidic sites to produce π‐complex adsorption with toluene, which improved the material's adsorption performance. The key adsorption mechanisms of Cu@UiO‐66‐2 material on toluene are thought to be π‐complex adsorption of unsaturated metal sites, π–π stacking between toluene molecules, and microporous filling. Meanwhile, the material was subjected to adsorption–desorption continuous cycle experiments, which showed that the material has high thermal stability, and the desorption efficiency was 88.2% after five cycle experiments.