Abstract and Summary A series of polyamide and copolyamide resins were prepared from carboxystearic acid or methyl carboxystearate, with ethylenediamine, hexamethylenediamine, adipic acid, or caprolactam as coreactants. None of the product formulations appeared suitable for use in hot melt adhesives. More promising were the liquid, reactive polyamides made from carboxystearic acid and polyamines. These products gave excellent adhesion value in scouting tests when used as one component in 2‐component epoxy adhesives and coatings. In other applications, C‐19 polyamides had enhanced solubility and low melting characteristics to make them attractive as modifiers.