串扰
插入损耗
CMOS芯片
材料科学
平版印刷术
薄脆饼
光电子学
硅
波导管
硅光子学
光学
物理
作者
Yi Zhang,Shuyu Yang,Andy Eu-Jin Lim,Guo‐Qiang Lo,Christophe Galland,Tom W. Baehr-Jones,Michael Hochberg
标识
DOI:10.1109/lpt.2013.2241049
摘要
We demonstrated a waveguide crossing for submicron silicon waveguides with average insertion loss of 0.18±0.03 dB and crosstalk of -41±2 dB, uniform across an 8-inch wafer. The device was fabricated in a CMOS-compatible process using 248 nm lithography, with only one patterning step.
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