材料科学
复合材料
氰酸酯
碳纳米管
热导率
环氧树脂
基质(化学分析)
氰酸盐
电导率
高分子化学
物理化学
化学
作者
Mingzhen Xu,Yangxue Lei,Dengxun Ren,Sijing Chen,Lin Chen,Xiaobo Liu
出处
期刊:Nanomaterials
[MDPI AG]
日期:2018-12-03
卷期号:8 (12): 997-997
被引量:20
摘要
Epoxy/cyanate resin matrix composites (AG80/CE) with improved thermal conductivity and mechanical properties were obtained with synergetic enhancement with functional carbon nanotubes (f-CNTs) and hexagonal boron nitride (h-BN). AG80/CE performed as polymeric matrix and h-BN as conductivity filler which formed the main thermal conductivity channels. Small amounts of f-CNTs were introduced to repair defects in conductivity channels and networks. To confirm the synergetic enhancements, the thermal conductivity was investigated and analyzed with Agari’s model. Results indicated that with introduction of 0.5 wt% f-CNTs, the thermal conductivity coefficient (ƛ) increased to 0.745 W/mk, which is 1.38 times that of composites with just h-BN. Furthermore, the flexural strength and modulus of composites with 0.5 wt% f-CNTs were 85 MPa and 3.5 GPa. The glass transition temperature (Tg) of composites with 0.4 wt% was 285 °C and the initial decomposition temperature (T5%) was 385 °C, indicating outstanding thermal stability. The obtained h-BN/f-CNTs reinforced AG80/CE composites present great potential for packaging continuous integration and miniaturization of microelectronic devices.
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