烧结
材料科学
可视化
收缩率
相对密度
热的
过程(计算)
可靠性(半导体)
纳米颗粒
冶金
粒子(生态学)
复合材料
功率密度
热分析
工艺工程
粉末冶金
钥匙(锁)
模具(集成电路)
机械工程
作者
Daisuke Hiratsuka,Shuto Usui
标识
DOI:10.1109/eptc67330.2025.11392185
摘要
This study presents a novel approach to pressureassisted sintering of silver nanoparticles by combining in-situ shrinkage measurement with Master Sintering Curve (MSC) analysis. A modified TMA probe enables accurate monitoring under pressures up to $\mathbf{2 0 ~ M P a}$. Relative density increased from $\mathbf{3 4 \%}$ before sintering to $\mathbf{8 4 - 9 4 \%}$ after sintering, depending on applied pressure. Activation energy analysis revealed distinct mechanisms including particle rearrangement, lattice diffusion, and a pressure-dependent low-barrier pathway. A key innovation is the visualization of sinterability using temperature-time maps based on relative density, enabling prediction of densification under various conditions. For example, at $\mathbf{5 ~ M P a}, \mathbf{8 2 \%}$ density was achieved by soaking at 573 K for 4 minutes. This framework also supports processproperty mapping, linking process parameters to joint performance. While mechanical and thermal properties were estimated from literature, the mapping methodology is extendable to other material systems. These findings provide actionable insights for optimizing bonding processes in power electronics, where thermal reliability and process control are critical. To our knowledge, this is the first report to integrate MSC-based densification modeling with sinterability visualization and process mapping, offering a new design tool for advanced packaging technologies.
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