Thermal Model of a Component Package for System Level Applications

Abstract The scope of this project is to assess the feasibility of developing thermal models of key component packages for system-level use. Two 32 x 32 mm Ceramic Quad Flat Packages (CQFP): 184 and 240 leads used for high performance microprocessors are evaluated both experimentally and numerically. Free air cooled PCs and low forced air convection workstations serve as the targeted system-level applications to be investigated. The numerical modeling is accomplished with the use of a Computational Fluid Dynamics (CFD) software package. This simulation technique allows for temperature fields to be determined within the package and its environment in addition to providing flow fields of the air surrounding the package. The thermal models are validated with measured data in both natural and forced convection conditions for two separate packaging schemes: 2 watts without a heat sink and 5 watts with a heat sink. Sensitivity studies on the package materials, grid densities, and radiation heat transfer are performed as part of the thermal modeling. The simulation results compare quite favorably with the experimental results, with the average error being less than 10%. Moreover, the work defines the thermal capabilities of the package to meet acceptable performance levels.