Mono and bilayer coatings of alkanethiol and silane on copper: Prevents corrosion and regulate bacterial adhesion

生物膜 硅烷 材料科学 粘附 接触角 双层 腐蚀 润湿 化学工程 铜 细菌 冶金 化学 复合材料 膜 生物化学 生物 遗传学 工程类
作者
T. Subba Rao,R. Feser
出处
期刊:Materials today communications [Elsevier BV]
卷期号:36: 106517-106517 被引量:2
标识
DOI:10.1016/j.mtcomm.2023.106517
摘要

Self-assembling molecules (SAMs) provide a flexible system for surface modification of materials by forming films of molecular thickness. SAMs protect materials from corrosion and modify surface properties such as adhesion, adsorption and wetting due to their molecular composition and orientation. In this investigation, polished copper specimens were dip coated to form SAMs of alkanethiol and silane to study bacterial adhesion as well as for corrosion prevention. The SAM coated specimens were exposed to the log phase cultures of Pseudomonas aeruginosa (aerobic bacteria) and Desulfovibrio vulgaris (anaerobic bacteria) for 12, 24 and 48 hrs, to monitor cell adhesion and biofilm thickness by microscopy. The results showed that alkanethiols SAM promoted adhesion and biofilm formation. The biofilm thickness ranged from 10 - 38 µm for Pseudomonas and 9 – 25 µm for Desulfovibrio sp. Among the SAM coatings tested, octadecyl-trichlorosilane (ODTCS), alkane-thiol and ODTCS (bilayer SAM) showed no bacterial adhesion, however, solitary alkane-thiol SAM showed significant bacterial adhesion. The high hydrophobicity (contact angle ~140°), antibacterial and anti-biofilm property of the ODTCS coating could have regulated bacterial adhesion. The constant climate test results showed that silane SAM prevented copper corrosion up to ~160 days (3480 hrs), while the alkanethiol coating could protect up to 10 days (240 hrs). Confocal laser scanning microscopic images of the silane coated copper specimens showed initiation of the corrosion after 160 days of exposure, while at the end of 200 days significant copper corrosion was observed. Surface modification leads to specific biochemical interactions that regulate bacterial adhesion and prevent biofilm formation and corrosion of copper.
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