Experimental and Numerical Investigation of the Tensile and Failure Response of Multiple-Hole-Fiber-Reinforced Magnesium Alloy Laminates under Various Temperature Environments

材料科学 极限抗拉强度 镁合金 复合材料 镁 合金 纤维 纤维增强塑料 冶金
作者
Zhongzhao Lin,Dongfa Sheng,Yuting Fang,Ke Xiong,Yuming Song
出处
期刊:Materials [Multidisciplinary Digital Publishing Institute]
卷期号:16 (16): 5573-5573 被引量:6
标识
DOI:10.3390/ma16165573
摘要

In this paper, the tensile mechanical behavior and progressive damage morphology of glass-fiber-reinforced magnesium alloy laminate for different numbers of holes in a temperature range of 25-180 °C were investigated. In addition, based on extensive tensile tests, the tensile mechanical behavior and microscopic damage morphology of porous-glass-fiber-reinforced magnesium alloy laminates at different temperatures were observed by finite element simulation and scanning electron microscopy (SEM). Finally, the numerical simulation and experimental results were in good accordance with the prediction of mechanical properties and fracture damage patterns of the laminates, the average difference between the residual strength values of the specimens at ambient temperature was 5.57%, and the stress-strain curves were in good agreement. The experimental and finite element analysis results showed that the damaged area of the bonded layer tended to expand with the increase in the number of holes, which has a lesser effect on the ultimate tensile strength. As the temperature increased, the specimens changed from obvious fiber breakage (pull-out) and the resin matrix damage mode to matrix softening damage and interfacial delamination fracture damage. As the testing temperature of the specimens increased from 25 °C to 180 °C, the tensile strength of the specimens decreased by an average of 51.59%, while the tensile strength of the specimens showed a nonlinear decreasing trend. The damage mechanism of porous-glass-fiber-reinforced magnesium alloy laminates at different temperatures is discussed in this paper, which can provide a reference for engineering applications and design.
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