材料科学
激光线宽
光电子学
纳米光子学
平版印刷术
光刻
薄脆饼
绝缘体上的硅
蚀刻(微加工)
制作
浸没式光刻
干法蚀刻
下一代光刻
硅光子学
硅
电子束光刻
光学
抵抗
纳米技术
激光器
物理
病理
图层(电子)
替代医学
医学
作者
Shankar Kumar Selvaraja,Wim Bogaerts,Pieter Dumon,Dries Van Thourhout,Roel Baets
标识
DOI:10.1109/jstqe.2009.2026550
摘要
We report subnanometer linewidth uniformity in silicon nanophotonics devices fabricated using high-volume CMOS fabrication tools. We use wavelength-selective devices such as ring resonators, Mach-Zehnder interferometers, and arrayed waveguide gratings to assess the device nonuniformity within and between chips. The devices were fabricated using 193 or 248 nm optical lithography and dry etching in silicon-on-insulator wafer technology. Using 193 nm optical lithography, we have achieved a linewidth uniformity of 2 nm (after lithography) and 2.6 nm (after dry etch) over 200 mm wafer. Furthermore, with the developed fabrication process, using wavelength-selective devices, we have demonstrated a linewidth control better than 0.6 nm within chip and better than 2 nm chip-to-chip. The necessity for high-resolution optical lithography is demonstrated by comparing device nonuniformity between the 248 and 193 nm optical lithography processes.
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