Power Cycling Reliability of Power Module: A Survey

动力循环 功率半导体器件 电源模块 可靠性(半导体) 温度循环 绝缘栅双极晶体管 晶体管 电力电子 电气工程 散热片 可靠性工程 半导体器件 功率(物理) 工程类 汽车工程 电压 材料科学 复合材料 气象学 物理 热的 量子力学 图层(电子)
作者
Camille Durand,Markus Klingler,Daniel Coutellier,Hakim Naceur
出处
期刊:IEEE Transactions on Device and Materials Reliability [Institute of Electrical and Electronics Engineers]
卷期号:16 (1): 80-97 被引量:163
标识
DOI:10.1109/tdmr.2016.2516044
摘要

Electronic devices using semiconductors such as insulated-gate bipolar transistors, metal-oxide-semiconductor field-effect transistors, and diodes are extensively used in electrical traction applications such as locomotive, elevators, subways, and cars. The long-term reliability of such power modules is then highly demanded, and their main reliability criterion is their power cycling capability. Thus, a power cycling test is the most important reliability test for power modules. This test consists in periodically applying a current to a device mounted onto a heat sink. This leads to power loss in the entire module and results in a rise in the semiconductor temperature. In this paper, the different kinds of semiconductors and power modules used for traction applications are described. Experimental and simulation methods employed for power cycling tests are presented. Modules' weak points and fatigue processes are pointed out. Then, a detailed statistical review of publications from 1994 to 2015 dealing with power cycling is presented. This review gives a clear overview of all studies dealing with power cycling that were carried out until now. It reveals the principal trends in power electronic devices and highlights the main reliability issues for which an important lack of knowledge remains.
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