Thermal Insulation Blocks Made of Sunflower Pith Particles and Polysaccharide-Based Binders: Influence of Binder Type and Content on Their Characteristics

吸水率 果胶 淀粉 材料科学 肿胀 的 复合材料 壳聚糖 化学工程 多糖 含水量 化学 植物 有机化学 食品科学 岩土工程 工程类 生物
作者
Aurélie Laborel-Préneron,Clara Ampe,Laurent Labonne,Camille Magniont,Philippe Evon
出处
期刊:Construction technologies and architecture 卷期号:1: 43-50 被引量:5
标识
DOI:10.4028/www.scientific.net/cta.1.43
摘要

Co-product of sunflower cultivation, pith of stem has a little exploited insulating potential. Blocks in which pith particles are glued together using a starch-based binder have already been obtained. However, they are highly water-sensitive. Replacing this binder with others has been considered here. Polysaccharide-based binders were tested, chosen for their more hydrophobic character: sodium alginate, chitosan, Citrus pectin, and a modified starch. Like starch, these binders are physically binding. They are first solubilised in water (except chitosan, dissolved in 2% acetic acid). The solution is then mixed with pith particles before cold compression molding for 90 s. A 10% binder content was initially considered. The blocks were all cohesive with a dry density from 36 to 42 kg/m 3 ). Their performances were assessed through water absorption capacity and resistance via capillary absorption tests on wet sponges, mechanical test and thermal conductivity. Chitosan and pectin-based blocks show the best properties, particularly concerning water resistance and mechanical properties. The pectin-based block has improved its elastic modulus by 40% compared to a starch-based block. The pectin-based block in its case absorbs 2.7 times less water than starch. Finally, thermal conductivities of pectin and chitosan-based pith blocks are in the same order of magnitude as for starch (39.8-40.1 mW/m.K), and close to values from commercial materials ( e.g. , polystyrene). Pectin and chitosan were also tested at three rates (5%, 10% and 15%). A significant improvement in the blocks' compressive strength was observed with the increase in binder rate, while thermal conductivities varied little.
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