A Facile Multi‐transfer Method by Flexible Tape for Micro‐LED Display Applications

A facile multi‐transfer method based on flexible tape was introduced and micro‐LED arrays was successfully transferred and electrically bonded to backpanel with a lighten yield up to 90%. The flexible tape could compensate the height variation of LED chips during the pick and place process. Multi‐transfer was achieved by the viscosity‐adjustable nature of the tape materials.