微加工
纳米技术
碳化硅
材料科学
半导体器件制造
制作
工程物理
工程类
冶金
医学
替代医学
病理
薄脆饼
作者
Roya Maboudian,Carlo Carraro,Debbie G. Senesky,Christopher S. Roper
出处
期刊:Journal of vacuum science & technology
[American Institute of Physics]
日期:2013-06-06
卷期号:31 (5)
被引量:164
摘要
Advances in siliconcarbide microfabrication and growth process optimization for siliconcarbide nanostructures are ushering in new opportunities for microdevices capable of operation in a variety of demanding applications, involving high temperature, radiation, or corrosive environment. This review focuses on the materials science and processing technologies for siliconcarbidethin films and low dimensional structures, and details recent progress in manufacturing technology, including deposition, metallization, and fabrication of semiconductor microdevices, with emphasis on sensor technology. The challenges remaining in developing siliconcarbide as a mainstay materials platform are discussed throughout.
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