Lithography‐free fabrication of a local contact interlayer for Si‐based tandem solar cells

Abstract Currently, the Si solar cell market share is dominated by PERC solar cells. Although the efficiency of PERC solar cells has been steadily increasing, it is expected to reach the practical efficiency limit in the near future. The thin film/PERC Si tandem cell technique can be one of the solutions to overcome the single‐cell efficiency limit. In this study, we developed a novel interlayer fabrication technology for the diffused junction Si solar cells of the PERC and Al BSF cell architectures. We combined laser contact opening (LCO) and laser‐induced forward transfer (LIFT) processes to fabricate local contact opening with low contact resistance while maintaining the high passivation performance of the Si bottom cell. The dielectric‐passivated emitter of the Si solar cell was ablated locally by the LCO process, and subsequently, the Ti nanoparticles were transferred selectively by the LIFT process to the opened emitter region followed by transparent conducting oxide deposition. Laser process parameters were carefully optimized to fabricate low‐loss interlayers. We applied the developed interlayer fabrication technology to the Si bottom cells of Al BSF and PERC cells. Finally, we demonstrated successfully the perovskite/PERC Si tandem cell with an interlayer developed in this study. The developed interlayer fabrication technology does not include a photolithography step and vacuum deposition processes for buffer metals; thus, we expect it may be more compatible with the mass production of thin film/diffused junction Si tandem solar cells.