材料科学
金属
墨水池
聚合物
化学工程
复合材料
高分子化学
化学
有机化学
工程类
作者
Rui Sun,Mengdi Ma,Xiangcai Ma,Haiting Kang,Shuo Wang,Jiazhen Sun
出处
期刊:Langmuir
[American Chemical Society]
日期:2023-05-16
卷期号:39 (21): 7426-7433
被引量:3
标识
DOI:10.1021/acs.langmuir.3c00642
摘要
In this study, flexible metal circuits are fabricated with polymer/metal precursor ink and an interfacial reaction by direct-writing technology. Poly(vinyl alcohol) (PVA) is selected as one component of ink, which could be a flexible composite in a metal circuit and an adhesive layer to connect the flexible metal circuit with the flexible substrate. Silver nitrate (AgNO3) is added to the ink as a source of metal. After the direct-writing structure was placed in contact with an ascorbic acid (VC) aqueous solution with an adjustable process, silver nanoparticles (AgNPs) with 100-400 nm uniform size could be generated on the direct-writing PVA skeleton. The resistivity of the composite silver layer could reach 10-6 Ω·m without any postprocessing. Meanwhile, the resistance change could keep within 20% with 180° bending after 10 000 repeat times. Patterned flexible metal circuits could be facilely fabricated by direct-writing technology, which presented excellent electrical conductivity and flexibility.
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