A fully integrated high power RF MEMS switch in package
作者
Sung Jun Kim,Yang Zhang,Minfeng Wang,Mark Bachman,G.P. Li
标识
DOI:10.1109/ectc.2015.7159706
摘要
We report a high power laminate switch for radio frequency (RF) applications. This switch can be embedded within RF circuits or serve as a standalone component. For various RF applications, we demonstrated how switch, RF and mechanical performances are correlated to each other by varying the design parameters. Low contact resistance, 0.3 Ω and decent RF performance, -0.35 dB insertion loss and -18 dB isolation at 9 GHz were achieved.