Heterogeneous integration of microscale compound semiconductor devices by micro-transfer-printing

Integrating microscale electronic devices onto non-native substrates enables new kinds of products with desirable functionalities and cost structures that are inaccessible by conventional means. Micro assembly technologies are the practical ways to make such microscale heterogeneous device combinations possible. Elastomer stamp micro-transferprinting technology (μTP) is a widely-demonstrated form of micro assembly, having demonstrated applicability in optical communications, magnetic storage, concentrator photovoltaics and display technologies. Here we describe new experiments designed to assess the useful lifetime of the viscoelastic elastomer transfer stamp, and also describe the methodology and results for heterogeneous integration of microscale compound semiconductor devices onto non-native substrates using μTP.