热固性聚合物
材料科学
环氧树脂
基质(水族馆)
复合材料
电极
粘附
吸收(声学)
化学
物理化学
地质学
海洋学
作者
Meiten Koh,Kazuyoshi Yoneda,Kazutaka Nakada,Shoya Sekiguchi,Shoko Mishima,Nobuhiro Ishikawa,Toshiyuki Ogata
出处
期刊:
日期:2022-05-11
被引量:2
标识
DOI:10.23919/icep55381.2022.9795447
摘要
We have developed novel thermosetting low Dk/Df film for 5G application by using novel curable PPE. It showed low Dk, 3.1 at 10GHz, and low Df, 0.001 at 10GHz, high Tg, 200°C, low CTE, 18ppm and low water absorption 0.04%. And it showed good laser via process ability and good adhesion to Electroless plated Cu. We have made stacked substrate with L/S=15μm/15μm comb electrode and B-HAST test was conducted, and it showed good endurance. Transmission loss of the film was better than that of existing epoxy type low Df film.
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