Self‐adhesive epoxy modified silicone materials for light emitting diode encapsulation

In this paper, we prepared the light emitting diode (LED) encapsulant with self‐adhesion and high refractive index. In order to improve adhesion properties, we synthesized a series of multifunctional polysiloxanes with different contents of epoxy groups via the sol–gel condensation of methylvinyldimethoxysilane, diphenylsilanediol and 3‐glycidoxypropyldimethoxymethylsilane. The structures of epoxyphenylvinyl silicone (EPVS) resins were confirmed by proton nuclear magnetic resonance and Fourier‐transform infrared. The effect of epoxy group content on the adhesion property of EPVS resins was fully studied. The performances of the LED encapsulation materials based on EPVS resins were investigated in detail. These self‐adhesive encapsulating materials showed excellent thermal stability, a high refractive index of 1.55 and good adhesive property. These EPVSs can be used as an adhesion promoter for LED encapsulation materials. Copyright © 2017 John Wiley & Sons, Ltd.