Electrodeposition of Dendritic Copper on Copper or Titanium Electrode from Aqueous Copper(I) Chloride Solution Containing Condensed Sodium Halides

Potentiostatic electrodeposition behavior of dendritic copper from acidic copper(I) chloride (cuprous chloride) bath containing sodium chloride and sodium bromide was investigated. Deposition current density of the dendrite onto a titanium cathode was lower than that onto a copper cathode with the same surface area, while the current efficiency and the morphology, or appearance, of copper dendrite were independent of the cathode material. The reproducibility of the current for the dendrite was poorer when as-polished titanium cathode was used, although a surface treatment of the cathode with an HF-H3PO4 solution before electrodeposition improved the reproducibility. The content of sodium as an impurity in the dendrite was independent of the cathode material.