坡莫合金
电镀
退火(玻璃)
材料科学
磁场
磁导率
冶金
光电子学
复合材料
磁化
图层(电子)
化学
量子力学
物理
膜
生物化学
作者
Eitaro Kubo,Naoki Ooi,Hidemitsu Aoki,Daisuke Watanabe,Jong‐Hyeon Jeong,Chiharu Kimura,Takashi Sugino
标识
DOI:10.1143/jjap.49.04db17
摘要
We have investigated the effect of a magnetic field on an electroplated Ni 79 Fe 21 film. We have succeeded in the formation of a Ni 79 Fe 21 (permalloy) film with high permeability by applying the magnetic field vertical to the electric field during the electroplating process. In a conventional NiFe electroplating process, annealing is required to obtain a stable Ni 79 Fe 21 film after electroplating. This process without annealing is useful for fabricating Ni 79 Fe 21 films for flexible devices and complementary metal oxide semiconductor (CMOS) integration.
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