A TGV-based Antenna in Package for 5G mm-Wave Application

Antenna in Package (AiP) relies on 3D packaging technology, which greatly shortens the feed line length, thereby reducing interconnection loss and improving system power efficiency. This paper briefly evaluated the performance of glass substrate as the 5G mm-wave packaging and then discusses the losses of 3 methods of the feed line. A TGV-based patch antenna is simulated at 28 GHz. The CPW feeding line between package and antenna is TGV. The TGV structure can reduce the interconnection loss and provide low dielectric loss. The proposed TGV-based patch antenna has the advantages of simple structure, bandwidth, and low loss, which can be applied for 5G communication.